Electronics Forum | Mon Oct 11 06:00:27 EDT 1999 | Brian
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Tue Sep 14 16:23:54 EDT 2004 | dan
What is your cure time for the mask?
Electronics Forum | Thu Jul 01 14:47:10 EDT 1999 | Tony
| | | My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side
Electronics Forum | Wed Feb 28 10:00:46 EST 2001 | dason_c
Please advise what kind of the solder mask, glossy or matt? Matt finished can reduce the solder ball significant. Check Enthone, Enplate DSR Series. Good Luck!
Electronics Forum | Thu Sep 16 15:01:13 EDT 2004 | russ
You may want to either open up the bottom of the vias so they will not "volcano". Or you will want to seal both sides. It never works having one side of the vias masked and the other open with HASL. Russ
Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef
Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.
Electronics Forum | Sun Oct 10 17:57:48 EDT 1999 | JohnW
Folk's, I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. I was wanting to do a straw poll on you guy's as to the type of resist's you are using Glos
Electronics Forum | Mon Oct 11 13:08:29 EDT 1999 | Dave F
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Wed Jun 30 17:58:01 EDT 1999 | Boca
| My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side it wo
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
