Electronics Forum: solderability issue (Page 232 of 307)

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Wed Dec 02 20:11:37 EST 2009 | prodivegsr

Hi Lou, we are using a fluid dispensing machine. our current requirement is around 50um. From the Datasheet,the thinner 73 has a higher evaporation rate of 1.0 comapring with thinner 521 at 0.6... does the higher evaporation rate eliminate the bu

Motherboard become NO POST when humidity increase to 90%

Electronics Forum | Sun Nov 22 09:36:17 EST 2009 | patrickbruneel

Dave, A low residue/No residue flux does exist that when an excessive amount of flux is applied it would only create a cosmetic problem not a reliability issue. The active ingredients are neutralized by the heat applied in the soldering machine and

Solder briding on QFP

Electronics Forum | Mon Jan 11 09:15:36 EST 2010 | lynn_norman

In a former job we had issues with leakage currents on a QFP. The component was acting as a thermal shield leaving a lot of flux residue behind. To make it worse, the flux solvent wasn't totally evaporated, so we had ionic residue, a fluid media, a

SMT in Austin

Electronics Forum | Thu Feb 04 09:31:21 EST 2010 | llaerum

I was wondering if someone on this forum are in Austin or Dallas. If so could they post the type of SAC305 WS solder they use. I am interested in type 3 and type 4. Due to our current vendors repeatability issues we are trying to find out who the la

Mixing No-clean and water soluble processes

Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist

Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re

PCB bows after wave soldering

Electronics Forum | Thu Jul 01 15:12:16 EDT 2010 | siddharth

Thanks to all for their inputs. @Hexielectronics, I am now trying to assemble the board by attaching it to a frame and removing the frame while waving it. I plan to put the boards back on the frame after the board cools down. Could you explain more

Flex Circuits - Bend proximity spec

Electronics Forum | Mon Aug 02 08:11:25 EDT 2010 | muarty

Is there a specification in relation to the proximity to features that a Flex circuit should or should not be bent? I am experiencing broken tracks on some flexible circuits which appear to be getting 'flexed' directly adjacent to a soldered joint in

Changing Ni/Au finish to HASL lead free

Electronics Forum | Tue Dec 21 11:49:33 EST 2010 | remullis

1st the buyer shouldn't control the process based on cost. Let them buy stuff and stick to that. 2nd, I do think leveling in th HASL process is important. If you have high spots on pads for fine pitch your wiping away more of that aperture than othe

BGA solder bridge - Adding Pictures

Electronics Forum | Thu Mar 03 14:05:49 EST 2011 | davef

Certainly the bridge is ugly, but the voiding is nothing that you should be bragging about either. Pretty ugly work. BRIDGING: If all of your shorts appear in the vacinity of the heat sink, consider reducing the amount of paste that you apply there.

Electroplate Touch up

Electronics Forum | Wed May 04 06:06:34 EDT 2011 | clampron

Good Morning, I have been working with a company that has a selective electroplate touch up system from Rapid Electroplate. They have used this for repairing gold electroplate. Scratches and in some cases, replating pads that had been contaminated w


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