Electronics Forum: checking (Page 233 of 631)

parts popping off during reflow

Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef

You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder

parts popping off during reflow

Electronics Forum | Fri Sep 28 09:30:07 EDT 2001 | kmorris

Just had a similar phenomenon 2 days ago. May relate to your issue --- or not. Like you, I did a once over looking for mechanical obstruction & couldn't find any. Ran a thermal profile on the offending PCB & all checked out. Looked in end of oven

PCB Manufacturers Certificate of Conformance

Electronics Forum | Wed Jan 02 12:11:32 EST 2002 | mparker

Ian is correct in saying that the Cert.s and x-section should be forwarded to QA. It would be the responsibility of Incoming or Receiving Inspection to validate the materials. Your suppliers are offering proof that they comply to industry standards o

Camera Problem on CP6-4000

Electronics Forum | Mon May 06 02:30:25 EDT 2002 | dszeto

We have continual vision process error 1CB02003 on narrow view camera during nozzle centering measurement. The wide view camera works properly. So far we have done the following things to rectify the problem but the problem still exists: 1. Replac

Temporary Stencil for MPC555 PBGA

Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc

Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu

Placement machine comparison

Electronics Forum | Thu Jun 20 08:59:57 EDT 2002 | John Burris

I agree with some of the earier postings about checking other mfgs. Assembleon and Juki are really two different price point companies. Assembleon is more in line with the Panasonics and Siemens of the world, Juki and Samsung might be a better focus

Connector solderability

Electronics Forum | Tue Nov 05 16:41:53 EST 2002 | Ray M

This one's got me stumped, so I thought I'd throw it out for discussion: I have a 20 pin SMT ribbon connector by Molex that I've been using for about a year without problem, but recently things aren't looking so good. The solder is pulled up off of

F4G & C/C SERVER

Electronics Forum | Fri Nov 22 10:18:33 EST 2002 | Joaquin Rodenas

Dear Mr. Liang I'm a service ingeneer in a distributor of FUJI products. My first suggestion is get some help from the FUJI dealer in your territory, but anyway try the following: First of all, check again the FTP tool included in F4G-main windows

Board with immersion Tin

Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax

You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int

Fine pitch paste release problems.

Electronics Forum | Sun Dec 22 06:00:54 EST 2002 | Mark

Hi: Your stencil specs are good; Did you check the stencil thickness? It would be worth a ck since there may be an error from the stencil mfr If the paste is not releasing with good stencil specs, these are possible causes: 1 The paste isn't tou


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