Electronics Forum: analyzers (Page 24 of 25)

PCB Supplier Evaluation And Qualification

Electronics Forum | Wed Feb 25 09:22:53 EST 1998 | Earl Moon

PCB Fabrication Supplier Evaluation And Qualification Made Easier Supplier evaluation and qualification often is left to uninformed industry references or vague suggestions made by sales unprofessionals. This discussion is met to enhance a customer'

PCB Supplier Evaluation And Qualification

Electronics Forum | Wed Feb 25 09:21:05 EST 1998 | Earl Moon

PCB Fabrication Supplier Evaluation And Qualification Made Easier Supplier evaluation and qualification often is left to uninformed industry references or vague suggestions made by sales unprofessionals. This discussion is met to enhance a customer'

Multi-part reeling for pick and place

Electronics Forum | Sat Jul 17 15:22:17 EDT 2004 | rohman23

Thanks for all the responses. I do agree with what was said, and can certainly see reasons not to try. I'll write a little more about what we do. We are a defense contractor, and as I mentioned very high mix, low volume. We only have 1 SMT line.

AOI vs. XRay

Electronics Forum | Tue May 08 11:27:49 EDT 2001 | Eyal Duzy

I will review some of the advantages/disadvantages of AOI vs. X-Ray one by one according to the main differences that you may find between them. * AOI uses optics that can "see" only visible elements. X-Ray can "see" hidden elements. There is a ve

Solder paste layout

Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef

I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever

Re: Adhesion loss on passives over wave

Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc

| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet

Re: Loading leadless parts(passives)by hand

Electronics Forum | Wed Mar 03 13:51:54 EST 1999 | Dave F

| We are a small division. We are starting up a leadless line with an old screen printer and a convection oven. At this time we don't intend to get any sort of pick and place assistance and wil be loading by hand. We find the biggest problem with

Re: Loading leadless parts(passives)by hand

Electronics Forum | Fri Mar 05 09:44:49 EST 1999 | Nancy Vandemark

Clarissa, Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for the par

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 16:55:50 EST 1999 | Chrys

| | | Hello, | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | So far, the tests I can think of performin

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef

From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject


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