Electronics Forum | Sun Jan 24 14:01:56 EST 1999 | Daniel
| I'm currently planning to do an evaluation of RMA flux solder pastes for mil type applications. Does anyone have any suggestions for vendors to try? I'm especailly interested in pastes that aid application on boards with 20 mil pitch. | "KOKI 95
Electronics Forum | Sun Nov 22 05:41:55 EST 1998 | Daniel
Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. Thanks!
Electronics Forum | Sun Nov 22 17:54:08 EST 1998 | Larry Johnson
| Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. | | Thanks! | Any screen shop should be able to handle that task. It is failry common these days.
Electronics Forum | Tue Dec 01 05:21:16 EST 1998 | S.R.
| Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. | | Thanks! | Hello Look in web site www.suron.com maybe it can help you.
Electronics Forum | Tue Dec 25 02:38:31 EST 2001 | jim1110
Hi All: We need the MIL-STD-883 to develop our solderbility,who can help me to find out the softcopy(free charge)! Tks!
Electronics Forum | Thu Aug 01 04:12:39 EDT 2002 | jk
Anyone have experience with BGA mount on via hole in pad. I'm encountering about 1 to 2% yield loss due to BGA solder short. This is an entek PCB. The BGA pad size is 32 mil, and the via hole (dia. 10 mil) is at the center of the pad. Any professiona
Electronics Forum | Tue Oct 22 12:40:31 EDT 2002 | stjdavis
You might want to check out a microline drill from LPKF Laser. It can drill holes down to 2 mil and do 2 mil lines and spacings.
Electronics Forum | Sun Nov 24 05:40:41 EST 2002 | albertoh
Hello!! I have a questions about what kind of squeegee blades i need for any step-down stencil in order to get the better results in my process. I have stencils with step-down from 10 mils to 6 mils. Thanks in advance.
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Fri May 16 20:55:05 EDT 2003 | jonfox
The term is still valid and used everyday by those in the die placement and "micro"-electronics world. MILS is too hard to understand at that level. Its just easier to say 10 microns than 0.3937 mils.
