Electronics Forum | Sat Feb 06 07:39:30 EST 1999 | Wayne Bracy
| | | I am looking for a piece of equipement that can | safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap. | | | | |
Electronics Forum | Tue Feb 02 12:43:01 EST 1999 | Rich Cary
My company produces a mixed technology control unit for automotive applications. We recently purchased an automated handler for our GENRAD in-circuit testing equipment and have encountered a challenge. We have several through hole components that,
Electronics Forum | Wed Jan 27 11:42:50 EST 1999 | John Zisa
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jul 07 07:44:23 EDT 1998 | Wayne
| Hey Dave... I agree with Steve, get them dry. Even though you are using DI water, once exposed to normal atmoshere the DI residue water will become contaminated. Fungus and board failure down the road. Not to mention if you plug it into test an
Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Sat Feb 02 08:55:55 EST 2002 | davef
I'd don't believe that the reels need to be ESD protective material. The carrier and cover tape have resistivity and materials specifications. Start with EIA-481. In past threads on SMTnet, we have discussed problems in picking components that wer
Electronics Forum | Wed Mar 20 11:14:15 EST 2002 | cfraser
Guy's I am sorry but your dike removal process for chip components is midievil at best. The fastest way to remove a chip is with 2 solder irons. Place one iron on each end of the component. This process is completely safe and takes about 2 seconds pe
Electronics Forum | Thu Jun 20 04:53:13 EDT 2002 | hany_khoga
Thanks Dave but unluckily my sweet BGA�s are surrounded by plastic connectors with hundreds of pins. Also my PCB�s are 4-layers so just thinking of doing what you suggest means ruining them for me. To be honest I tried bypassing the baking issue bef
Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
