Electronics Forum: solder and joint (Page 24 of 388)

Pb free BGA and Sn Pb solder paste

Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken

...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.

Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 16:07:44 EDT 1998 | G. Hamblett

Looking for articles/data comparing the quality/reliability of mass reflowed SMT solderjoints versus hand soldered SMT solderjoints.

BGA Solder joint appearance for the Motorola 860

Electronics Forum | Mon Jan 14 20:33:33 EST 2002 | dason_c

Can we say the "Jiffy Pop" is same as void? Also, please provide the manufacturer location, Malaysia?

Differences between solder paste alloy SAC305 and SAC405.

Electronics Forum | Wed Sep 29 19:47:44 EDT 2021 | emeto

"For the lead free soldering of electronic assemblies, the inclusion of silver in the alloy results in better wetting compared to non-silver containing alloys and also allows for a broader process window. Silver also improves joint reliab

Pb free BGA and Sn Pb solder paste

Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz

Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried

Lead-free and Leaded solder in the same reflow

Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike

At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit

VOIDS on Solder joint (backside of D2PAK heatsink)

Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan

Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho

BGA Solder joint appearance for the Motorola 860

Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef

While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER

Tension on a SMT joint at the Solder wave process

Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner

Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl


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