Electronics Forum | Thu Sep 13 13:04:52 EDT 2018 | jrs192
Hello! Recently started buying PCBs with peelable mask to remove the need for Kapton tape. Had no issues with our first batch, but our supplier has over-cured the second batch - it comes off in tiny bits, and is stuck in the holes. After timing the
Electronics Forum | Fri Jan 04 22:23:23 EST 2019 | ameenullakhan
Hi, Here we take profile for every changeover. And we compare it with our profile.For the oven performance. We daily take a minimum of 3 profile for one oven. We have High mix low volume production. We are using ORH1 ( organic flux with halid cont
Electronics Forum | Tue Jan 15 14:11:12 EST 2019 | griinder
I also use these when available. The problem still persists for Bottom Paste/Parts layer. The non-symmetric(x axis) footprints in the Btm part layer, display correctly in the software, But then display incorrectly when imported into the Printer. The
Electronics Forum | Wed Feb 13 09:30:32 EST 2019 | SMTA-Joe
*UPDATE* I decided to modify the experiment slightly by forgoing my attempt to achieve reflow with the component. Instead I applied SN42 paste directly to the pad and attempted reflow of the paste by itself. The end result is as follows: Hotplate
Electronics Forum | Fri Jun 07 11:19:14 EDT 2019 | gregoryyork
If you have soldered with HASL finish then the worrying chemistry will be more like NON IONIC. They sit there and attract moisture like mad and any chlorides they hold ionize in the moisture attracted and cause electromigration or SIR issues. They ca
Electronics Forum | Thu May 09 08:03:07 EDT 2019 | SMTA-Joe
Hello SMTA, We have some flex board assemblies that will require conformal coating. Coating rigid boards is nothing new, but this will be our first with flex. Are there any challenges associated with coating flex PCBs? on this particular assembly
Electronics Forum | Wed Aug 07 18:25:52 EDT 2019 | slthomas
Normally if the package is defined properly I would expect your machine to place it correctly but we have some parts pushed right down to the pads. If the paste is centered, and the parts are centered, and you have obvious bridging potential coming
Electronics Forum | Wed Dec 04 16:31:23 EST 2019 | kylehunter
Hmm, OK thanks for the input guys. Yeah, I'm surprised because our profile seems pretty solid, and it is such an isolated issue. I like the thought of the flux drying out as a potential cause. It was definitely exposed to the air, and while we tried
Electronics Forum | Thu Jan 16 10:07:12 EST 2020 | davef
Hej back at ya Your connectors could be warping during reflow. Find out by putting a connector on a hot plate and increasing the temperature. If so, you might get away with a simple fix of rotating the board 90* on your reflow oven conveyor. If you
Electronics Forum | Thu Jan 30 20:10:24 EST 2020 | sarason
Clever idea. I used to work on hybrids. baking temp about 850 degrees C we used titanium and ceramic substrates. the high temp was needed to make the resistance layer partially melt. remove the resitance and you can run at the silver melting point an
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