Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Tue Mar 30 02:32:42 EST 1999 | Scott Davies
We have carried out some experimental work, in conjunction with DEK. Instead of dispensing adhesive for SMD components onto the bottom side of on of our PCBs, we have looked at the possibility of screen printing the adhesive. Because, at the stage of
Electronics Forum | Fri Mar 12 15:23:06 EST 1999 | Steve Schrader
| SMTNetters: excellent Forum, keep up the good work all! | | We are in the process of purchasing a Dek Stencil Cleaner and we have been recommended to use Vigon SC200 solvent to remove Heraeus no-clean solder paste from stencils and mis-printed PCB
Electronics Forum | Tue Oct 12 17:09:25 EDT 1999 | Kevin Ham
Scott: Call me I will send you a sample of our Cleaning Detergent. Kevin Ham PMR Systems, Inc. 480-829-8170 ext. 11 | SMTNetters: excellent Forum, keep up the good work all! | | We are in the process of purchasing a Dek Stencil Cleaner and we
Electronics Forum | Thu Feb 18 17:49:28 EST 1999 | Ryan Jennens
Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal
Electronics Forum | Thu Dec 24 02:17:22 EST 1998 | Chris Grendler
Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The pit
Electronics Forum | Thu Dec 24 09:32:53 EST 1998 | Earl Moon
| Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The p
Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
Electronics Forum | Thu Nov 12 20:57:04 EST 1998 | Dave F
| | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | Fraser- | | We use polyimide stencils with great success for our prototype boards. They are cheaper and the accuracy/aper
Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
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