Electronics Forum | Tue Jan 15 09:42:40 EST 2002 | davef
Here's two choices. 1 Before accepting a lot of boards from your supplier: * Print some paste on a board * Reflow the paste * Inspect the quality of the solder connection * Make a decision on accpting the board based on that observation. 2 Have yo
Electronics Forum | Wed Feb 20 10:28:38 EST 2002 | jax
Silver in paste is usually employed to prevent scavenging of silver from silver plated surfaces, BUT Dave's right. I wouldn't think Components are uniform enough to base a process change on. See how it goes with what you have. You will probably find
Electronics Forum | Wed Mar 20 11:36:50 EST 2002 | slthomas
Are you saying L x W x H didn't answer his question? Unless he wants to know how you're verifying that the post reflow fillet is adequate (which is determined by his pad size as well as your print process and the % metal of your paste), I don't get
Electronics Forum | Thu Mar 28 17:54:57 EST 2002 | slthomas
I realize that this is sort of off-topic, but do you have scads of solder beads (mid-chip solder balls, whatever you like to call them) with that stencil design? If not, would you mind sharing which paste it is that you are using? Email if you like
Electronics Forum | Tue Apr 09 16:19:37 EDT 2002 | Peter L.
Has anyone built using the ALIVH PCB (0402, 0.8mm pitch uBGA) on the SMT line? I would like to know any process issues (paste printing, p&p, reflow) related to processing this pcb. Specifically, what type of solder paste was used (no clean) and wha
Electronics Forum | Wed May 01 22:20:02 EDT 2002 | saiwong
We can't affort the new QP132. It costs more than a million bucks each plus power feeders. We can only buy from the used markets. CP7's X-Y Table is moving too fast. They need special solder paste. Very expensive solder paste to hold the components.
Electronics Forum | Thu May 30 11:37:27 EDT 2002 | Ron Costa
Hi Ray, A couple of things to look into: 1.date code of reel 2. what is the termination made up of tin/lead or tin/lead/palladium. Check with part manufacturer. 3.paste volume/aperture openings 4.PCB plating 5.solder paste formulation Good luck R
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi
We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump
Electronics Forum | Wed Jun 12 18:04:47 EDT 2002 | stownsend
Is this a new problem on an old product, or is this a first run? If this is a new problem on an old product, you may want to check the paste process. If the paste is not even across both pads or is offset a bit, the parts will pop up. If this is a f
