Electronics Forum: having (Page 2380 of 3473)

Re: Corroding Solder Joints

Electronics Forum | Tue Dec 28 10:57:53 EST 1999 | Amy Castor

I have tried the water soluble flux and the aqueous cleaners but I got the same results you did; horrible corrosion and a white flaky mess. I know exactly what you're talking about. We do a lot of hand soldering around here, and the magical solutio

Re: PTH connectors mounted on SMD process

Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward

I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is

Re: smt on flexible board

Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris

If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev

Re: Screen Printer Visual Inspection Equipment

Electronics Forum | Fri Dec 17 16:25:05 EST 1999 | Brian W.

I used an off-line paste height measurement device to control my paste process. I did not inspect every board, just a random sample once an hour. I have used both manual and automatic devices. I like the automatic becuase: 1 - I have no "operat

Re: Solder Balling Beading Effect

Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron

Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu

Re: Soldering long lead thru hole parts

Electronics Forum | Thu Dec 09 23:57:41 EST 1999 | Jeff Sanchez

Mike, A drag solder system is not so bad. If it's not discoloring the silk screen , damaging your parts or blistering your boards than it looks like a safe bet. I am not sure what other components you have on the boards besides the LED's? But the

Re: Solder Paste Dispensing for BGA repair

Electronics Forum | Fri Nov 26 06:18:18 EST 1999 | stefano bolleri

Jeff & Ted, we have used a dispensing system too and yes, I agree, we are not too happy with the results. Not at the point that it doesn't work, though. I think our problem basicly is that we have selected an entry-level dipensing system. We are app

paste release from stencil, and volume calculation

Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas

We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 19:45:48 EST 1999 | Steve Thomas

1 Money IS an object, and my boss will be thrilled. The stencil manufacturer recommended ovals to facilitate better release. Seems likely to be true, but whether or not it's necessary I don't know. We have perpendicular walls on these (6 mil) ste

Re: Siemens

Electronics Forum | Fri Nov 05 17:17:32 EST 1999 | NickMata

Fred, The system will base itself on the information within the GF file. In the GF file you provide the description as to the physical dimensions, features, tolerances and handling for the part. Once the component has picked up the image, it is "see


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