Electronics Forum: ovens (Page 239 of 505)

Reflow

Electronics Forum | Wed Oct 11 21:38:48 EDT 2017 | action_101

It is a window in which you look thru (all reflow > ovens have them) to observe the process > firsthand. LMAO... Great Response

Requirements for a room with SMT equipment

Electronics Forum | Wed Sep 20 07:14:14 EDT 2017 | stephendo

Talk to the sales person that sold the equipment. If it is new equipment talk to the manufacturer. You will need electrical power and air. You will want the room to be clean and dust free. You will need to vent oven air to the outside. You will prob

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 13:30:08 EST 2017 | kojotssss

Stencil thickness is 4 mil. Via's are plugging from bottom. Gas may be developed under the component? Take Reflow Ovens Thermal Profiling changes? In your opinion?

0402 LED TILT

Electronics Forum | Fri Nov 24 05:38:46 EST 2017 | jineshjpr

Can anybody suggest how to reduce 0402 LED tilting as I am using Convectional Reflow oven with 10 Heating zones and controlling the solder paste with 4.2 mills paste height

Can anybody suggest how can I achieve good solderability in convectional reflow oven If I reduced Convection Air Speed 80%. The

Electronics Forum | Thu Dec 14 14:43:54 EST 2017 | kahrpr

Just Curious why would you need to reduce the air speed by 80%

led tilt reduction by reducing convection air speed in reflow oven

Electronics Forum | Thu Dec 14 05:07:55 EST 2017 | tsvetan

picture of the problem would help people to speculate what you do wrong

led tilt reduction by reducing convection air speed in reflow oven

Electronics Forum | Thu Dec 14 15:05:17 EST 2017 | emeto

I am pretty sure, you are looking into the wrong spot. Your paste is too much, or your part has very inconsistent narrow leads(that includes wrong pad design as well.)

led tilt reduction by reducing convection air speed in reflow oven

Electronics Forum | Wed Dec 20 07:16:16 EST 2017 | stephendo

I agree with Evtimov. What he didn't point out is that the surface tension of the solder would vastly overwhelm any force from air flow.

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Tue Feb 13 05:11:58 EST 2018 | ameenullakhan

Hi, We are using 10+2 reflow oven ( BTU Pyramax 150 ). We have tried with short TAL ( RTS profile too ). As of Now we are using the attached profile, which has given us lot better results. But the issue is not eliminated. Thanks


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