Electronics Forum: chips (Page 240 of 260)

Digital Counter Chip Project

Electronics Forum | Thu Jul 16 05:15:37 EDT 2009 | discovery747

Foreword 2009-07-16: This information was /is posted at http://www.discovery747.com/counter hosted by Yahoo Small Biz. Unfortunately yesterday for the first time in years this site was down. Today is up again, and I hope it stays that way. So in case

Desiccants and pcb finish degradation?

Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef

I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability

Underfill Inspection Criteria

Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef

On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc

I had a nightmare

Electronics Forum | Thu Jun 28 08:14:11 EDT 2001 | Stefan Witte

I visit customers on a contract base to get the machines in a status, that an operator can take over. These customers are usually small shops, who can not effort an engineer to set up the machines. I am not afraid of my job, if it does not require a

solder balls

Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef

Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug

Multitroniks, Quad System and Tyco Info

Electronics Forum | Wed Aug 01 09:36:17 EDT 2001 | Pete Barton

Jay, > > I agree with your assement and Chips on > the Quads. I once worked at a shop that had Quads > and DynaPerts(at the time) The perts were > slower(TIME) and required(EFFORT/PEOPLE) more > MAINTENANCE(more effort more people and more > re

Re: IR Versus Hot Air - Put-Up Your Dukes...........Not a lot of blood guys!!!

Electronics Forum | Tue Sep 28 22:43:26 EDT 1999 | Dean

| I finaly get a vacation and decide to go to the forum and low and behold it's hot air verses a small ray of sun.I read every thread and still failed to see any real argument either way? I love rework as an assembler. I hate rework as a shop owner.

Re: Solder Iron Temp.

Electronics Forum | Tue Sep 07 20:46:55 EDT 1999 | Jeff Ferry

| | | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | | My question is what solder temp should be used for this part? | | | Any advice is appreciated. | | | THX. |

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon

| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut

Re: No-clean stencil apertures

Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko

| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.


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