Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef
Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are
Electronics Forum | Wed Sep 18 14:58:59 EDT 2002 | Claude_Couture
Just to add my 2 cents on the adjustment of pitch on MPA feeders: True: Panasonic do not make it easy to change the pitch on MPA feeders, the thickness of a metal part is what sets the pitch. My solution: for example, I get a 24mm X 12mm pitch MPA
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence
Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte
Electronics Forum | Wed Oct 30 01:23:22 EST 2002 | jasper
It has been my experience that when all > conditions are as they are supposed to be there > should be zero or very little deflection. When > you start placing components with pick and place > equipment that does not have a Z pressure sense, > yo
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Electronics Forum | Mon Dec 16 10:23:42 EST 2002 | Grant Petty
Hi, I have checked the archives, but need some advise. We have a 256 pin 1 mm pitch BGA part of our boards, and we have having problems with paste release our of the holes for the BGA. We just cannot seem to get it right, and we have to keep the st
Electronics Forum | Wed Jan 08 22:33:24 EST 2003 | jonfox
1. Do you have the necessary equipment to take on such a task and 2. Why? My only guess is that you are looking to find the probability or likelihood of a particular observation and / or a "confidence" score on your other equipment. This is just a
Electronics Forum | Thu Jan 16 03:43:42 EST 2003 | johnw
1st off for the forum folk, I don't like the fact that the new system only let's you see the posting your replying too, I'd rather be able to see the thread..... Anyhoo, why this alloy?, it's because it's the device manufacturers preferred and the c
Electronics Forum | Wed Feb 12 12:06:58 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
