Electronics Forum | Thu Oct 26 16:38:08 EDT 2000 | Philip A. Reyes
Hi Sir Charles! Good Day! I hope you can help me about my queries. 1. What is the acceptable misregistration or misalignment of balls after reflow soldering of PBGA module on the PCB? 2. Is there any criteria for solder ball defect or solder beads
Electronics Forum | Sat Jan 17 15:06:54 EST 1998 | Stefan
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Wed Jul 19 21:11:40 EDT 2006 | ec
Hi Dave, Sorry that I did not explain clear enough. What I mean normally after reflow, the solder joint is very smooth and there is wetting. But now we see there is hole on the solder surface and is not on the same loaction. This product have been r
Electronics Forum | Wed Oct 10 08:01:28 EDT 2007 | ck_the_flip
We use Indium 1074-EXR on ERSA, and it's performed miracles on our yields. Spot soldering, like wave, is all about fundamentals. Put just enough flux, preheat to prevent thermal shock and activate the flux, and then solder with enough dwell time to
Electronics Forum | Mon May 26 11:02:17 EDT 2008 | jandon
Hi Mr. Necdet Ozyonum, Recently we did have same kind of problems when we use lead free reflow profile for leaded solder paste (AIM WS-483). There where solder resist lacks, we found white residue after aqueous cleaning. Not in the solder joints but
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Wed Aug 19 15:24:21 EDT 2009 | smt_guy
I have a customer who approved and asked us to process PCB's built with Lead-Free HASL Finish using Eutectic Solder. We did as directed and inspected the result from a 10-PCB Run and couldn't find any problem with solderability or issues. What Issue
Electronics Forum | Wed Sep 01 17:34:18 EDT 2010 | kevm
Having solder flow issues on gold pads. Issues started when supplier switched adhesive tape used to cover pads during varnish process. By running SEM/EDX and XPS analysis it has been determined that the new tape leaves behind a thicker organic residu
Electronics Forum | Mon Sep 17 09:47:18 EDT 2012 | mbnetto
Hi, Do you want to replace the SB ou just reflow it again? Do you suspect there is some "colder solder joint" in one of the SB balls ? In my opinion you are heating the board a lot... Did you put some thermocouple on the ball to check the temperat
Electronics Forum | Wed Aug 12 17:18:03 EDT 2015 | dyoungquist
Here is our solution: We run the assembly line 40 hours per week and use 500g cartridges of solder. We take 1 cartridge out Monday morning and leave it out until the end of the Friday shift when it is put back into the refrigerator. That means you
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