Electronics Forum: yield (Page 25 of 55)

Step stencil troubles

Electronics Forum | Fri Sep 17 13:24:27 EDT 2004 | Bob R.

I also agree with Russ - we use step stencils when we have to but generally try to avoid them because the print isn't as consistent as with a single thickness stencil. Many of our products are for harsh environments so we do a lot of thermal cycle a

N2 delivery supply

Electronics Forum | Tue Mar 15 12:20:47 EST 2005 | Material Man

The use of nitrogen in lead free wave solder operations is primarily used to reduce or even eliminate drossing of the solder, thus improving solder yield. The higher priced lead free solder makeup (Cu, Ag) make this a more economical proces than the

CCGA

Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS

For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 08:18:55 EDT 2005 | kvanzill

Yes we have purchased a second machine due to low through put so he will be here on the 6th of June....I will be involved with training then, but so far I have not seen great support from this company as far as thier own knowledge of some problems th

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 23:21:53 EDT 2005 | Mats

Please explain Your line configuration needs or the volume by: components/panel/day/operators(people)/investments/yield/customer requirements/Your own req./etc. that You need. In Your initial thread You said that You had a low volyme production and

Soldering with Electroless nickel

Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers

I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv

gold wire bonding

Electronics Forum | Wed Dec 28 21:18:12 EST 2005 | davef

You don't TS bond gold wire to nickel [of ENIG] for the same reason that you don't TS bond gold wire to hard gold. [Nickel or maybe cobalt is used to harden soft gold.] Together nickel and gold produce unreliable bonds. Look here: * http://www.smta.

SMT Assembly Line

Electronics Forum | Wed May 31 10:01:59 EDT 2006 | vickt

Efren, Dover Technologies is maybe the only true supplier of a whole SMT line combining DEK, Universal Instruments, Vitronics Soltec, Hover Davis and others. Based on the information you've provided you may want to consider the AdVantis or Genesis

DFM for Wave

Electronics Forum | Mon Jul 17 16:38:41 EDT 2006 | dave

Guys, My problem is that I have a 10 up panel and I have to use a selective pallet to run it thru the wave process due to SMT on bottomside. However the yields are very poor. We have done everything to improve them with some good improvements along

Quad Auto Program SW

Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | SteveT

I would yield to bob on all Quad matters, but what I see here on a fresh install (we're upgrading a PC on one machine from a *386*) is that the new board name button is grayed out. That being the case, how do you create your first board? We'll be co


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