Electronics Forum | Thu Nov 01 10:10:49 EST 2001 | caldon
DAVE- Sorry for the late response.... as I was outta da country fer a bit. Wolfgang has a great point...If your machine has linear scales or encoders and they are dirty (even a spec of dust) this could have a huge impact on the positional data (esp.
Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker
If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time
Electronics Forum | Tue Dec 11 04:43:35 EST 2001 | maubrey
I am the director of a performance/art group who work with electroacoustic clothing. Esssentially we perform with electronic clothes that make sounds by react with/to the environment. Please take a look mat our web site (complete wi
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Thu Jan 10 06:41:43 EST 2002 | Dreamsniper
Okay, I've read about the pros and cons about solder paste dispensing. Now, I have a Camalot 3800 and I want to experiment about dispensing solder paste. I have a needle gauge of 25GA, 23 and 22. My pcb components are; RC 0603-1812, Size B, C and D
Electronics Forum | Thu Aug 29 06:48:01 EDT 2002 | yngwie
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only
Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Fri Feb 22 00:46:18 EST 2002 | djarvis
How about that. Gets through to the second round of the 1500m on his arse going BACKWARDS. Then falls on the last turn of the second heat! He said "I thought I might be a bit tired as I hadn't slept for 34 hours two days before, after the "Medal". M
Electronics Forum | Wed Feb 20 13:23:33 EST 2002 | dgeorge
I have some interesting problems on my hands that some of you may know the answers to. I am currently wave soldering a through hole connector to a rigidized flexible circuit. This is a compliant pin connector that is supposed to be pressed into a h
Electronics Forum | Fri Mar 01 08:35:27 EST 2002 | caldon
I am on board with Dave F.(like I usually am). I can not imagine what IPC specs the auditor is speaking about. The Stencil Design criteria, 610, and 001 do not fit the type of solder deposition you speak of (nor I think they should). The machine para
