Electronics Forum: profiler (Page 242 of 462)

Thermal Profilers

Electronics Forum | Wed Feb 20 08:52:52 EST 2008 | ck_the_flip

Having been around the block, an old lead head from way back, I've used MOLE, KIC,and Datapaq. They all do the same thing, but I'd have to give the edge to KIC. 9 ports and automatic wave detection. Also, KIC2000 is as user friendly as you can get

BGA Voids

Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd

What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 16:19:26 EST 2008 | edatasys

Check out http://www.solderstar.co.uk/wavePro.html This tool measures all key wave solder information with a single pass. Wave/PCB contact, immersion depths, etc. Also has a reflow pack to allow use on reflow, 9 channels with predictive software. B

Wave and Reflow Profiler

Electronics Forum | Wed Feb 20 08:17:32 EST 2008 | ck_the_flip

Steve, KIC does. The new KIC2000 has built in dwell time sensors. You can buy KIC's wavesurfer option (like MOLE's waverider), or you can engineer a custom pallet for 1/3 the price. I made a custom pallet and took advantage of the KIC's automatic

Soldering problem on BGA with SAC105 bump

Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal

I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total

Does anyone remember the takt time formula for the reflow oven

Electronics Forum | Mon Mar 31 07:58:50 EDT 2008 | vinitverma

Assuming the following: L=Process Length of the oven t=Desired profile time in mins(depends on the paste/glue used) l=PCB length l1=gap between consecutive PCBs Then the total no. of PCBs per hour is" (L*60/t)/(l+l1) Vinit

What caused this reflow issue?

Electronics Forum | Mon Apr 14 14:11:30 EDT 2008 | cyber_wolf

I dont know if this is related, but there appears to be a blister/measle in the upper right corner of the Q19 large pad. (upper right of Q19 as you are facing the photo) If your profile and paste is good, my bet would be that there is something wron

thermocouple for profiling

Electronics Forum | Fri Apr 18 14:46:29 EDT 2008 | ck_the_flip

Aluminum Tape is the way to go. Here is a thread from our fine SMTNet archives: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9891&#Message39736 DO NOT get those clampable temperature probes. Waste of money. The

Super Mole Thinline RS232 Cable

Electronics Forum | Fri May 02 11:11:49 EDT 2008 | lon_sanders

The cable required for the Thinline has to work as a true RS232 interface as the unit uses all the capabilities of RS232. You will have several problems with substitutes. These cables (part number e00-2787-26) are still avaliable from ECD, the home o

RNETs and Lead Free

Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz

We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin


profiler searches for Companies, Equipment, Machines, Suppliers & Information