Electronics Forum: about (Page 243 of 1194)

SMT line validation

Electronics Forum | Wed Feb 22 20:38:04 EST 2006 | davef

Dirka Jihabi The FDA doesn't care about the method your company chooses. FDA require in their "Good Manufacturing Practices [GMP]" that your company defines a method and abides by that method. Now, if the fine folk at your company selected a naive

ESD Flooring

Electronics Forum | Thu Feb 23 09:39:38 EST 2006 | rlackey

We went with the expensive tiled floors - look great until you try and move any machinery, & I still have nightmares about air skates.....

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Fri Feb 24 04:49:23 EST 2006 | Loco

Give the Ersa a look. Big advantages: closed loop and no 10 different nozzles. (I wont boast about 'how great' it is, give your local Ersa rep a call and decide for yourself!)

PHILIPS TOPAZ

Electronics Forum | Sat Feb 25 22:36:34 EST 2006 | Ken

Hi I need to look for a user guide or anything that shows you how to operate the Philips Topaz machine. Anyone know of any wedsite or anything about Philips Topaz machine please let me know. much appreciated.

MRP / ERP Systems

Electronics Forum | Wed Apr 12 19:10:36 EDT 2006 | ted nguyen

don't know what kinda price range these systems that you guys mention are in, but, for about 600-700 dollars, PCMRP is very low cost and quite user friendly.

PFMEA and SPC/Cpk program

Electronics Forum | Tue Mar 07 11:13:04 EST 2006 | Brian

Air Academy Associates has a nice SPC package that has the PFMEA calculations built in to it. It also does Cp/Cpk/regression analysis, MSA, et al.You can combine it with a reaally user friendly DOE software for about $250. Both use Excel. Brian

How can I measure the consistence of glue application in a Gemin

Electronics Forum | Tue Mar 07 15:17:10 EST 2006 | davef

Right now it's Girl Scout Thin Mint Cookies. We bought about 15 boxes. They freeze well.

LLP Device

Electronics Forum | Thu Mar 09 04:04:48 EST 2006 | dougs

one point to remember is to have a large stencil reduction on the thermal pad, you need to reduce the solder volume by about 35%, if you don't you risk the solder from the thermal pad shorting out the other leads or the solder volume causing the comp

Dross removal

Electronics Forum | Wed Mar 08 18:56:20 EST 2006 | jsloot

Several weeks ago, there were some postings about a new product for reducing dross in the wave solder pot. It was, I think, a liquid. Both for Tin/Lead and lead free solder. Anyone remember who this vendor is?

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Wed Mar 29 10:07:58 EST 2006 | Slaine

where are your pear shaped balls located? :) you said about 10% of the balls have been affected are they mainly around the egde of the BGA or in the corners ect?


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