Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud
Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times
Electronics Forum | Sun Jun 21 18:06:45 EDT 1998 | Fred Dub
New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for whom the tape feeding for a long time was the solution. The rapid growth in the number of passive component
Electronics Forum | Fri Jul 10 00:04:44 EDT 1998 | Fred Dub
| New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for | whom the tape feeding for a long time was the solution. The rapid growth in the number of passive compo
Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich
The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the
Electronics Forum | Fri Jun 12 15:24:30 EDT 1998 | Steve A
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Thu Jun 11 15:49:33 EDT 1998 | Steve
| | In our continued search for another flex machine, we reconsidered Philips | | Emerald (low Vol/high mix Mfg). We already have a CSM so it makes a little sense. Then the salesman started talking about the Topaz. The Topaz supposedly is "practicall
Electronics Forum | Fri May 22 11:59:54 EDT 1998 | Earl Moon
| I hear ya' Earl! I don't know why there seems to be such a push for us to eliminate lead...you're right, assemblers are pretty clean when it comes to lead....actually, the whole industry is, when compared to other industries and the amounts of lead
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Sat May 09 11:54:12 EDT 1998 | Bob Willis
All the comments that have been made a great but I do have to say that much of the problem comes back to the design engineers not designing for manufacture. Centre board supports would have sorted the problem without jigs. | | I am running a board t
