Electronics Forum: chip (Page 25 of 260)

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders

I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o

Components near breakouts

Electronics Forum | Fri Jan 08 07:45:00 EST 2016 | nonford150

My DFM rules are no chips within 250 mils of a breakout and all chips in parallel to the breakout. Made these changes after some nasty line failures years ago. Not one in or out of house failure due to cracked discrete chips since.

Bright Tin metalisation on CHIP components

Electronics Forum | Tue Jan 19 10:27:33 EST 2021 | grahamcooper22

Anyone experience high voiding levels in SMT lead free solder joints when the CHIP has bright tin plated end caps ? In the same process, Matte tin plated CHIPs don't show any voiding issues.

Re: Flip chips - need info on handling and packaging

Electronics Forum | Mon Jun 29 13:54:54 EDT 1998 | Russ Miculich

Diane: I would suggest you contact Chip Supply in Florida and find out how and what they specify to their suppliers. They inspect, test, package, and distribute many suppliers chips for flip chip and other applications. I am sorry but I do not have

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy

Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your

COB Process (Chip On Board)

Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI

Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject

Found solder bridging under SMT Chip of Wave process

Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.

Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)

CALCULATION EQUATION FOR 1 CHIP SOLDERING COST IN SMT PROCESS.

Electronics Forum | Mon Jan 17 02:40:17 EST 2000 | park kyung sam

Hi. smtman would someone answer me ? it's just the stuff pop ups without deep thinking. how much do our department spend money for 1 chip soldering. what should i consider ? i wonder i spend more money than other guys out there for 1 chip soldering i

bulk feeding chips

Electronics Forum | Wed Feb 05 20:56:23 EST 2003 | jonfox

I think you just answered a questioned that I never thought to ask. Are bulk parts manufactured differently than standard tape and reel parts? That would explain why there is a bigger price difference in parts from Murata and not from others. As I

Re: SMT Chip terminal lifted

Electronics Forum | Wed Jan 19 02:00:36 EST 2000 | erico

Hi wolfgang, I think Pc is not talking about the tombstone cause this terminal lifted is different from tombstone. The terminal of chip is still there but can not be solder anymore so we have to replace the chip. I also facing this problem. So can yo


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