Electronics Forum | Wed Feb 26 18:48:01 EST 2003 | kennyg
I'm trying to solder a 0.011" lead into a 0.015" +/-0.003" hole. Stop laughing please. This is normally possible with difficulty, except if the lead is removed and the attempt is made to re-install a lead. Anyone have thoughts on how to remove nea
Electronics Forum | Fri Feb 16 11:37:58 EST 2007 | hectorsmtnet
I have been using the Loctite Multicore WS200 with great results for the last two years. We also use the lead free version WS300. I like the flux chemistry (which is the same for both products); it really withstands long soaking times and with very g
Electronics Forum | Mon Sep 15 11:03:51 EDT 2008 | swag
Thanks all for the input. There are no tants. close to these parts. GSx - you are correct in that this is ROHS compliant component so maybe a plating issue. We have done what you describe but to a lesser peak with fair improvement. Not seeing muc
Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B
We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now
Electronics Forum | Wed Oct 17 02:53:36 EDT 2001 | dszeto
The fine pitch QFP is a 240 pin one being loaded with other components on a 2.0mm thick FR4 PCB. There are 6 of this Qfp's on this PCB showing the same charactristic of bowing therfore the solder fillets are vary from the center to the end of the pa
Electronics Forum | Wed Aug 05 06:34:33 EDT 2020 | oxygensmd
Yes if you adjust the thickness to be thin than the machine raise the PCB more to the stencil - than the foil have better tension but it string out faster.
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
Electronics Forum | Wed Sep 22 10:03:07 EDT 1999 | Boca
| | | | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the s
Electronics Forum | Mon May 20 15:43:01 EDT 2013 | ngotranbestek
Hi I meet problem by PCB with diameter 300cm and thick 6mm i used tin-lead with profile normal, soak time 60-90 sec, Temp peak is 220 degree C, But solder see not good, not shiny. Any body recomend help me to fix this problem for Hard gold playing.
Electronics Forum | Mon Apr 12 04:56:54 EDT 2004 | qualitel
Hi Eric, Every mounter have a standard count and "release" off the component. The sample and cost saving way is to use the paper (e.g: 4mil,5mil...thick) to measure. Just place on the PCB with supoort base below and release the nozzle step by
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
