Electronics Forum | Thu Oct 14 08:01:48 EDT 1999 | JohnW
Gee Dave That's the first time I've ever seen myself listed for a quote! Brian, what your saying is on the whole right, on the surface of it the mask, as long as it's cured properlay shouldn't make a difference but I have to say that I've found so f
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Tue Feb 27 22:40:28 EST 2007 | davef
IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic f
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Tue Oct 06 17:36:20 EDT 2020 | hearsehauler
Have used stencils for low volume paste printing for 18 yrs. New job uses jet printing (MY500). But machine is limited to .33mm dot size. Parts used here have pad sizes that are .25mm or smaller, so paste touches between pads when printed. Thankfully
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Fri Jul 02 05:28:13 EDT 1999 | Vinesh gandhi
| | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design).
Electronics Forum | Wed Feb 28 03:57:46 EST 2001 | peterbarton
Are you using a water based flux? Are the solder balls mainly around or near non-plated holes or near the edges of the PCB? If so the preheat must be set so the water content of the flux is fully evaporated before the board hits the solder wave. If
Electronics Forum | Wed Jul 19 17:34:25 EDT 2000 | Deon Nungaray
Craig, I'd be really hesitant in pursuing this method for a TQFP. Remember, most SMD's are rated for a maximum rising slope of around 4C/Sec. Immersing a fragile TQFP in a hot wave of molten solder will probably exceed this ramp up rate. Besides thi
.gif)
