Electronics Forum | Sun Jul 18 21:36:42 EDT 2004 | KEN
This is the least desirable method (mirroring). 1. X-ray inspection becomes difficult. I will repeat: x-ray inspection becomes difficult. False fails go up. True fail detection goes down. 2. Remove and replace becomes challenging. You really
Electronics Forum | Tue Jul 20 06:25:54 EDT 2004 | resslerr
In addition you may want to research a product offered by Sony...www.timmsweb.com This product has recently exploded onto the market and it has enabled Sony to enjoy a competitive advantage in manufacturing over the last decade. This system has all
Electronics Forum | Wed Aug 04 10:19:51 EDT 2004 | davef
Consider: * Reducing the size of the pads * Reducing the amount of solder paste * Inspecting the print. A print with irregular form (eg, print finishes with a tail, the print is inclined or something like that) * Too long in the reflow zone * Bad ali
Electronics Forum | Tue Nov 23 16:38:12 EST 2004 | rodionp
I will let you use our software for free before it goes retail (planned for january - february 2005), if pricing is a concern for you. We do feeder setup optimization as well as assembly sequence optimization (however we don't do line balancing).
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 31 20:40:43 EDT 2004 | davef
Please excuse us if we seem dense, but we're stuggling to understand your problem. Are you seeking a supplier for pads [like those used to repair boards] that you can epoxy to your board? If so look here: http://www.circuittechctr.com/products/cond
Electronics Forum | Wed Sep 01 13:32:42 EDT 2004 | Silverado
I am looking for equipment suggestions for cleaning PCB Assemblies using the small dishwasher type cleaners. I have seen and used them before but cannot remember the manufacturer etc and have not been able to find any info on these type of cleaners.
Electronics Forum | Tue Sep 14 10:24:53 EDT 2004 | pjc
MPM is a printing machine design and mfg company based in Franklin MA USA. Printing machines are used to deposit hi viscosity materials such as solderpaste, adhesives and silver epoxy used by the electronics assembly and semi-conductor industry. The
.gif)
