Electronics Forum | Tue Oct 31 01:08:25 EST 2000 | Dreamsniper
Here are some: Printing Speed : 2.5 ips (inch per sec) Stencil Thickness: 10 - 12 mil but the latter is the best. Dots sizes: u can get that from the Forum Archive...I used Dave F's dot sizes recommendation...they are good! Squeegee Blade : use met
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Mon Sep 25 10:18:00 EDT 2000 | Vic Lau
Dear Friends, I am handling a new project, and search for a solder paste stencil printer (automatic or semi-automatic) for lead free solder paste. The one I had looked for is MPM3000 series, however, what I heard from other freinds, those model is
Electronics Forum | Tue Aug 29 12:22:36 EDT 2000 | Mike Konrad
I�m sure others will spew out commercials as a response to your question, but I�ll refrain. Stencil cleaner manufacturers include: Aqueous Technologies (800) 218-8128 www.aqueoustech.com PMR (480) 829-8170 www.pmrsystems.com SmartSonic (818) 909-6
Electronics Forum | Fri Aug 04 10:42:26 EDT 2000 | James
So Darby do you use your clamshell printers in production, if so what volume? Do you use a snap off distance? With our current printers the board is held with tooling pins, when the stencil is lifted the board has a tendency to stick and lift to so
Electronics Forum | Sat Jul 01 04:22:09 EDT 2000 | Sal
I have two questions 1. How do I control the skewing of FETs/power regulators ? ( the one's with the big rectangular pad and two smaller one's for the leads).If I go 1:1 with the apertures I seem to get solder balling and when I tryed to minimise th
Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea
That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely
Electronics Forum | Fri May 26 01:50:54 EDT 2000 | Craig
We have no experience in printing glue only in dispencing for short runs. We are finding that our gluing volumes are going up and want to look at screen printing as an option. We are placing 0805 and 1206 chips, melfs, sots and ics. What are the adva
Electronics Forum | Wed Apr 12 21:43:56 EDT 2000 | Micah Newcomb
Is this board going across wave? If not, you are pretty safe to lose the glue process. If it does go across wave you can probably lose the solderpaste and replace your solder stencil with a glue stencil, much faster and efficient than dispensing.
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