Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Fri Aug 28 18:57:49 EDT 1998 | Mike Cleary
Selecting the correct label solution for SMT labeling is a science. Our company is a supplier of electronic identification products. Please let me know if you have questions regarding materials, printers, etc. I have been in this industry for over
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
Electronics Forum | Mon Aug 17 10:23:35 EDT 1998 | Steve Gregory
Good Day All!! I hope ya'll had a decent weekend, I did...didn't do a damn thing, I like weekends like that. Anyways, the big guys here are thinking about buying a "Flying Probe" tester, and the G.M. came to me and asked what I thought of them. I ha
Electronics Forum | Thu Aug 20 09:30:27 EDT 1998 | JUSTIN MEDERNACH
| Good Day All!! | I hope ya'll had a decent weekend, I did...didn't do a damn thing, I like weekends like that. Anyways, the big guys here are thinking about buying a "Flying Probe" tester, and the G.M. came to me and asked what I thought of them.
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Fri Jul 24 09:50:13 EDT 1998 | Justin Medernach
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | We don't even bother wit
Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud
Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times
Electronics Forum | Thu Jun 25 14:33:51 EDT 1998 | Chry
| Hi there Chris! | Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the location
