Electronics Forum | Mon Mar 05 13:29:00 EST 2012 | acsscott
Anyone have any input on this? I have checked to make sure all the component I am trying to pick up at the same time have the same camera, light levels, and detection type. I can't figure out why it picks 4 parts up, places them, then comes back fo
Electronics Forum | Wed Apr 04 07:33:31 EDT 2012 | christian01976
Hello! For "gang-pick" you need to have nearly the same Pick High. And for simultanious scan over the camera the Z Value of the parts have to be nearly the same too. The allowed differences are somewhere in the Machine Info or Machine Config. Try so
Electronics Forum | Thu Jun 28 16:43:51 EDT 2012 | ssupertuba
Yes I have a KIC and have checked the profile often. I just changed the reel of the parts that are causing problems and it went away. Now what am I suppose to say? I have made an NCMR for the parts but I'm sure they would work in an environment of
Electronics Forum | Mon Jul 09 18:29:19 EDT 2012 | btipcb
I have gotten to what I hope is the last step before I can start running product. However, I have and keep receiving an "Invalid Place Position X" error in three steps of the placement program. I have verified that the camera can indeed find these
Electronics Forum | Mon Jul 16 12:09:25 EDT 2012 | mikesewell
Our MY12 is having trouble picking both out of feeders and the TEX using the MIDAS head. The nozzle (spring or rigid) will go down and touch the part but won't pick it up. I get a Level too high error - the pick location isn't obstructed, part isn't
Electronics Forum | Thu Sep 06 15:41:23 EDT 2012 | rway
This appears to be a non-standard marking. Where did you find this? What is is out of? The 84 may be related to the cap value. Have you tried to measure it? I'm not sure about the "EG" part of it. This marking may be mfg specific, but the stand
Electronics Forum | Tue Sep 18 12:47:33 EDT 2012 | mbnetto
Hi, Regarding to thermocouple placement, you should use a precision thin drill. Drill through the bottom of the board to the top as follows: One hole in the center of the part, preferably into one of the center balls, if available. One hole into the
Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay
We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think
Electronics Forum | Wed Oct 03 09:23:21 EDT 2012 | kkay
Well what we have seen so far is that the voiding occurs on nearly every part, but only underneath the terminations. When we run a board with no parts we do not see any voiding as there are no terminations to trap the out-gassing from the pads. Next
Electronics Forum | Sun Oct 21 22:17:19 EDT 2012 | eadthem
We have had this issue on several parts in the past, typically we use a grid of squares of solder paste on large flow areas, This helps reduce but not eliminate all voiding. I would be very interested in hearing what you come up with. O and what is
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