Electronics Forum | Wed Nov 17 15:05:29 EST 1999 | Wade
I have had an Orbotech VT-8000 running in-line for almost a year and have been very pleased. The VT-8000 does everything the application engineers say it can do. The support and honesty provided by the Orbotech staff is outstanding. I talked to Vi
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
Electronics Forum | Mon Jul 19 05:40:57 EDT 1999 | HERMAN
| | My wavesoldering machine is equipped with Titanium finger. What composition of Titanium alloy used ? Any grade difference, and which is the best grade for long life ? An info or website concerning it. | | Dear Barden, | | Sorry, I am not fami
Electronics Forum | Wed Jun 02 19:31:01 EDT 1999 | Tony
| | | Dear All, | | | | | | We are a medium sized sub contract manufacturing house, engaged in high mix, medium volume production. We are using no clean as well as Aqueous cleaning process. we are planning to buy a new wave soldering machine out o
Electronics Forum | Thu Feb 04 16:08:05 EST 1999 | Ryan Jennens
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. | | Thanks much, | | Earl Moon |
Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte
Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are
Electronics Forum | Sat Sep 26 19:16:54 EDT 1998 | Graham Naisbitt
Ajit, How clean is clean? Are you running fine-line, fine-pitch; COB, BGA, Flip-Chip; making high rel circuits and putting them into a hostile environment? Well, as I have just posted to an earlier similar question on the SMTNet, there is no such thi
Electronics Forum | Fri Jul 24 02:32:35 EDT 1998 | Frank J. de Klein
| Hi, | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | Any good suggestion would be highly appreciated! | Stoney Tsai *
Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
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