Electronics Forum: reflow and ovens (Page 251 of 361)

Re: Climatic Controlled Facilities

Electronics Forum | Mon Jun 07 11:25:41 EDT 1999 | Brian Wycoff

| | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave solder

Re: Climatic Controlled Facilities

Electronics Forum | Mon Jun 07 16:52:51 EDT 1999 | Dave F

| | | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave sold

Delamination

Electronics Forum | Tue Apr 27 12:14:08 EDT 1999 | M Cox

Board Experts I am fighting with a board house about a delamination problem.. First the facts 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. 2) 150 Boards with this part number built with the same reflow oven settings (212 c max t

Attenna assembly for RF board

Electronics Forum | Fri Jan 29 15:39:04 EST 1999 | Chris Jackson

I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the anten

Re: Bob Willis Free Advertising

Electronics Forum | Thu Aug 06 22:01:29 EDT 1998 | Dave F

| No sour grapes, | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely on this

Rework using flux pens

Electronics Forum | Tue Jan 08 11:28:30 EST 2002 | mregalia

We use NC flux exclusively for SMT and wave soldering. And it is a fairly old formula from Multicore, though we are currently qualifying a new formula. The automated soldering does not appear to be a problem. It is only the hand soldering that causes

Insulated Metal Substrate Pcb's - "Thermal Clad"

Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru

Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c

Production Line Setup

Electronics Forum | Wed Jun 19 12:42:45 EDT 2002 | nuezmaster

The problem that my exec. had was that he did not want to add too many people to the department because there is no telling how long the demand will stay high. Therefore, I decided just to add a PCB inspector between the Pick and Place machines and

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs

Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug

Capability Process CPk

Electronics Forum | Fri Jan 17 04:07:12 EST 2003 | iman

A) Paste Printer : A1) identify the critical SMDs' pads. (choice should go to the BGA, CSP, MLF types...RES,CAP last in line...) A2) get a Paste measurement machine that measures readings of paste height (or better - volume) you are paste printing


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