Electronics Forum | Wed Oct 03 12:04:55 EDT 2001 | slthomas
When we found this to be a problem with some QFP 100's (.020" pitch, and our first experience with fine pitch - 48 of them on a 2-up panel), we saw that the solder was running up the leads during reflow and staying there, leaving the fillets thin or
Electronics Forum | Tue Oct 09 11:22:08 EDT 2001 | nifhail
Can I use one common cleaning agent to clean the stencils from a lines which are using RMA, No-clean and clean paste ( b'cos we onlyhv one stencil cleaner ). What about those misprinted board ? Can all of them use the same chemical or cleaned in the
Electronics Forum | Thu Nov 15 07:59:53 EST 2001 | John S
My company is in the process of evaluating dispensing/screen printing vendors for a new production line that will build a mixed through hole and smt board in high volume. DEK recently came out with a system that uses a thick plastic stecil with mach
Electronics Forum | Thu Feb 21 21:50:38 EST 2002 | dougk
Silly question, but, are TR blades 'exactly' the same size as MPM's and seat themselves in the holders just like MPM's? Also, different types of steel are harder (less flexable) than others. Are TR's the same? If harder (due to steel strength or coat
Electronics Forum | Fri Feb 22 00:25:46 EST 2002 | Jones
There appears to be less of a blade sticking out of the holder than the MPM set up. Thats something we noticed recently. We have our mechanical attack angle set at 0 degrees right now, but we are in the process of changing this setting by 5 degrees t
Electronics Forum | Wed Mar 20 11:55:19 EST 2002 | slthomas
Interesting. Ours failed miserably. Of course we toss everything on the stencil at the end of a shift (they are instructed to let it run down to minimal volume on the stencil as they approach quitting time) so it's not an issue. We are more concer
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Tue Jun 04 13:11:49 EDT 2002 | stepheno
One thing that has worked for us is to get the full size stencil for the board. Then we put a bit of paste on it, then someone holds the BGA on the other side and we apply paste to the BGA. It can be awkward. We only use this technique for if we ar
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
