Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Fri Apr 05 17:38:54 EST 2002 | davef
We socket no parts prior to the wave. This practice is an artifact of the days when we�d solder PTH socketed parts from the heat of the wave being conducted through the socket leads to the leads of the component. Sockets??? Thaint sockets no more.
Electronics Forum | Wed Apr 24 03:24:53 EDT 2002 | Gang shen
today I succeed placing the BGA at the other table(table2), the part data is only changed with "pitch_limit"=50%,lead_check_ area=50%,lead_brightness=0. but when I process vision at the tale1(which equipped the MTU),still failed,the error message is
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Wed Jul 10 13:33:40 EDT 2002 | bentzen
Hi You might be right that the ban will go ahead eventhough some indications, like the report from Germany, show it will be an environmental drawback. In Denmark I�m aware of 2 lead-free invetigating projects on the way. I participate in one of t
Electronics Forum | Thu Jul 25 15:14:05 EDT 2002 | dsorg
In the case where fiducials with a HASL finish are removed from a panel in the depanelizing process, what do most people do for disposing of the rails? Since the HASL finish has lead in it, is it generally required that they be disposed of like print
Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef
Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't
Electronics Forum | Wed Oct 23 14:45:00 EDT 2002 | Tom G
I haven't tried anything like that but had some experience with .8 mm pitch SSOPs. Immersion depth in wave was very critical- had to control Lambda pump speeds within 20 RPM and even then it would change as solder level dropped. Need thieving pads o
Electronics Forum | Tue Dec 17 09:48:44 EST 2002 | russ
Temps are related to the components/PCBs being soldered. I am not aware of any Industry standard. If you are soldering flex circuits, .020" boards etc.. We use 500 deg tips a little thicker PCB/lead we go to 600, and so on. We never exceed 800 in a
Electronics Forum | Thu Dec 19 12:08:01 EST 2002 | davef
Facts!!! I got facts. Mechanical strength experiments of Sn43/Pb43/Bi14: �Microstructural And Mechanical Characterization Of 43/43/14 Tin/Lead/Bismuth�; J. Marshall, J. Calderon, J. Sees; Soldering And Surface Mount Technology; 10/91, p25-27 Look
