Electronics Forum | Thu May 01 12:46:19 EDT 2008 | dphilbrick
Thanks for the link Samir. Although this thread does have some good info in it I don't think it is hitting the exact point I am trying to resolve. This seems to talk to a one profile fits all for running lead and lead free paste. I want to know about
Electronics Forum | Thu May 01 18:26:50 EDT 2008 | jmelson
I am partial to Weller for the small rework irons. I use both the WSL with WMP (current model) and some older EC1302 irons with their power supply (I forget the model, but the one with analog setting knob and digital temp readout). I actually prefe
Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig
No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with
Electronics Forum | Tue Aug 26 12:52:04 EDT 2008 | circleprime
I have recently started to use RMA flux (customer requirement) for some of our projects. I am finding that some of my BGAs are slightly off. Not enough to be rejected but enough to cause concern. In the past I have been able to rely on the surface te
Electronics Forum | Tue Oct 07 16:19:34 EDT 2008 | mikesewell
If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can d
Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist
As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data
Electronics Forum | Tue Feb 09 23:40:19 EST 2010 | glennster
OK Sergey, looks like no one wants to take this on. I will give it a shot and maybe others will add their 2 cents. The answer depends on what you want to inspect. X-ray inspection is based on the X-ray absorption properties of the materials in th
Electronics Forum | Thu Nov 03 16:47:52 EDT 2011 | hegemon
You need to define what it is you are inspecting for, and more importantly, what benefits you are trying to achieve with your acquisition of the technology? Inspecting post placement, post reflow, or both? Solder Joints? Through Holes? Part numbers
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Fri Nov 21 11:00:27 EST 2014 | gregp
Hi J_Dub (Joe), Thanks for the input. Sounds like some fairly densely populated through hole assemblies. 100 solder joints per board is up to 50 parts per board (I know you may have DIP's so it could be less than 50). 24 boards in a panel x 50 par
