Electronics Forum | Tue Jun 02 16:02:13 EDT 1998 | Earl Moon
| First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. | The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part
Electronics Forum | Sat Jun 13 00:25:59 EDT 1998 | Scott McKee
Last October I purchased a Mydata over a Phillips and Amistar. I've done things on my Mydata that is impossible on the other machines. I can build the top side and the bottom side of two boards at the same time (I print both sides at once). I can "
Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Tue Apr 07 17:33:17 EDT 1998 | Eldon Sanders
I agree with Michael, scoring works great. We build both and medium size small boards, anywhere from 2 to 100 square inches. Thickness from .030 to .062 Panels contain anywhere from 2 to 16 boards. About half are odd shaped, with cutouts and not
Electronics Forum | Fri Mar 06 23:13:13 EST 1998 | Scott Cook
| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need
Electronics Forum | Mon Jan 26 04:48:48 EST 1998 | Grant Petty
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Wed Aug 15 18:48:58 EDT 2001 | mparker
I would consider the fab placement in the printer to be of more concern than the pro's and con's of a single foil for top and bottom print. Do to the larger size of the fab you will have to align the top and bottom layers sequentially on the foil. O
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
