Electronics Forum | Mon May 10 10:53:20 EDT 2010 | dilogic
Does anyone have some experience with AIS3500 on GSM1? It stopped to function just like that. I've opened it to check the batteries and I can see 4 status LED's blinking in a constant pattern, but I can't get any response over seial line from it...
Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Electronics Forum | Wed May 19 15:42:46 EDT 2010 | davef
Hear ya. Mostly, we production people. So, we shy away from home brew soldering techniques, unless we get ourselves in a mess. That being said, there's a fair amount of stuff on the web about home brew BGA and fine pitch QFP soldering. Here's an
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Tue Jun 15 19:14:51 EDT 2010 | hegemon
You also need to consider the total metal load in your dispensable paste. You'll need a slightly higher flux content and less metal, say around 87% total metal, in a 4 or 5 mesh size. We had to have some special mixes made in order to do fine pitch
Electronics Forum | Sun Jun 06 12:51:34 EDT 2010 | whitewing
Hi - I'm looking into possible low-end pick/place machines (in UK) for prototype/small runs - taking the next step from plastic stencil/hand place/pizza oven, as my local subcontractors can't offer the fast turnrounds I often need for short runs. Bud
Electronics Forum | Wed Jun 30 14:06:24 EDT 2010 | jax
I assume you are talking about a Foreign Object Elimination checklist... It should include: 1. Date 2. Shift (if applicable) 3. Section designee 4. FOB Monitor 5. Supervisor 6. List of items being checked... ex. 1. "FOE bags are available and i
Electronics Forum | Wed Jun 30 03:56:45 EDT 2010 | tpvnew
Thanks for the input. I am reading IPC9850 and have a question on its statement. ========================================================== 4.2.9 Preventative Maintenance (PM) Time ... Calculation Method: Multiply the amount of time required for ea
Electronics Forum | Wed Jul 21 12:19:01 EDT 2010 | mb_mfg
To eliminate warping during processing, we have provided customers with composite fixtures to support the board on all 4 edges, with retractable pull down claps that can be added to the top of the PCB after the screen printing. Simply by pushing the
Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan
We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als
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