Electronics Forum: solder joint separation (Page 253 of 317)

Lead trimming

Electronics Forum | Fri Jul 29 13:30:43 EDT 2016 | gregp

Versatec specializes in the remanufacture of Contact Systems machines, most notably the CS-400E component locator with programmable cut and clinch. these machines are field proven over the past two decades and provide many benefits when utilized: 1.

63/37 HASL Finish / RoHS Solder Paste

Electronics Forum | Tue Oct 25 11:48:03 EDT 2016 | dontfeedphils

Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, with a known good thermal profile. I'm guessing it

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan

Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref

Circuit cam and mydata

Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft

Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre

Grey Solder After Cleaning

Electronics Forum | Tue Oct 20 05:47:42 EDT 2020 | Mike Konrad

Most often, dull solder joints (post cleaning) is a result of the cleaning chemical. Most (not all) modern cleaning chemicals are equipped with corrosion inhibition agents which prevent dulling. Check with your chemical supplier to see if your specif

Re: Process Change

Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 14:06:16 EDT 1999 | Dave F

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 15:19:14 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Process Change

Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Curious on how this thread developed

Electronics Forum | Wed Jun 23 14:23:14 EDT 1999 | Cunli Jia

Dave, Looks like you just replied to Ryan's original question, but the message itself shows that the two of you have been going back and forth. Did you copy from your email discussion? Just curious whether something is going wrong with the Forum.


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