Electronics Forum | Fri Feb 05 09:22:25 EST 1999 | Dave F
| | | Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F | | Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via hole
Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall
Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Electronics Forum | Fri Jun 09 10:04:16 EDT 2006 | Rob
I know it's friday afternoon, and it's actually hot for once in this country, so my brain may not be working properly here, but isn't 30 micro inches of gold about 0.75 Microns? So that's dead in the middle for gold plating thickness (like gold finge
Electronics Forum | Tue Jan 03 11:01:19 EST 2012 | julie331975
We are working with .065" thick metal core PCB's. I have a couple boards that are in need of rework. The components we are placing are similar to a SOJ package with a solder pad underneath the component. We are also using a lead free process. I have
Electronics Forum | Mon Jan 28 19:58:58 EST 2002 | davef
Well, reflow certainly would increase your preheat, wouldn�t it? On the other hand, some PTH [and SMT] components cannot bear the heat of a reflow oven. Some boards will never see proper barrel fill, because of either: * Design of the board. * Sl
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Thu Apr 15 14:56:43 EDT 1999 | Dave F
| Can anyone suggest or identifiy standards which tabulate the following: | | Conductor width, cross sectional and area conductor thickness for PCB's carrying up to 70 Amps? | Barry: Check: 1 Printed Circuits Handbook (Clyde F. Coombs) 2 Microel
Electronics Forum | Thu May 06 19:56:30 EDT 2004 | bruceatknoll
Here is some more info with regarding my Wave. 1. PCB .065" thick 2. leed length .20" (.135" protrution) I know this is high but we use many thousands and cutting each is not practical. 3. no clean flux by way of foam fluxer 4. wave machine is a HOL
Electronics Forum | Mon Jan 13 17:39:49 EST 2020 | avillaro2020
Hi, I need help on how to address the solder wicking on the samtec searay connector after reflow resulting to open solder joints on thick and thermal heavy PCB (4.4mm and 6.3mm). I increased my solder paste thickness to 8 mils, the connector is manua
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