Electronics Forum | Fri Nov 11 13:52:05 EST 2011 | SheanDalton
What is the size of the low standoff components you find trace wash effluent? and, what is the gap from the board to the underside of the component? If your component has a very low standoff, and/or, a wide footprint, you may want to consider findi
Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp
Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef
Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki
Electronics Forum | Thu Apr 19 08:50:38 EDT 2007 | rgduval
Welcome to RoHS. Or, at least, to the version of RoHS that I've had to deal with since I started with my current company. Blowholes and pinholes seem to be common in PB-free manufacturing. At least, they have for me here. I also note that IPC has
Electronics Forum | Mon Jun 30 01:30:14 EDT 2008 | benefon
Hi Well as the feed movement is effected by means of a spring return force there really isn't that much to do apart from checking the spring tension and keeping the friction surfaces of the ratchet mechanisms of the feed sprocket and the top foil pu
Electronics Forum | Tue Oct 05 14:38:06 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Jun 28 21:07:00 EDT 1999 | Deon Nungaray
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW
Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co
Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean
| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar
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