Electronics Forum | Mon Jun 04 23:52:57 EDT 2012 | rway
Actually, if you experience lack of witness marks, you probably have a problem. Witness marks are OK and will not affect your assembly. I assume this is an SMT assembly we are talking about, in which case, this is what your test pads are for. You
Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm
Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned
Electronics Forum | Mon Jan 21 08:28:33 EST 2013 | proy
I am looking at assembling a relatively small baord, but it is very thin and precise. It is .010" FR4, with 1oz copper two sides. ** Components are only on one side** It has some 0201's and a .4mm pitch BGA among other leadless packages. Where
Electronics Forum | Sat Jan 26 21:33:39 EST 2013 | sarason
Looks like you have a carbon black process that isn't quite plating to completion, pin prick size holes have remained in the plating. When dipped in an etchant (ie any acid or H2O) the holes grow and they leak carbon. This may be more of a problem th
Electronics Forum | Mon Feb 25 09:34:37 EST 2013 | davef
Oded: The coatings that I mention serve different purposes. * Antiadhesions seem to be designed to improve paste release from the stencil * Flux repellents seem to be aimed at reducing the under wipe frequency of stencils. At IPC APEX 2013, DEK and
Electronics Forum | Tue Mar 12 09:56:50 EDT 2013 | emeto
Hi, I don't know what you mean by really odd parts. Are they SMT parts that have a flat surface to pick them up? If so, probably several machines can do it. I know for sure Siemens can place almost anything. THey will help you with any type of nozzl
Electronics Forum | Sat May 18 15:19:55 EDT 2013 | isd_jwendell
OK, I've now read all of the documents you referenced. The problem still remains regarding the thermal vias and how to minimize scavenging. All the docs acknowledge top and bottom tenting, and it's problems. TI says don't do it. Plugging is usually n
Electronics Forum | Thu Aug 08 11:28:34 EDT 2013 | simplycomplex85
I found a manual for a slightly newer version of my machine and it explained some of the terms that I wasn't familiar with. That helped. Also it seems a slightly newer version of the YTV-2000 series has TH built right in. Mine just doesn't. I playe
Electronics Forum | Tue Sep 10 17:40:14 EDT 2013 | caurbach
Let me start off by saying that although we pot a decent variety of products, we have never been asked to do something like this, so this is not based on personal experience. This is just my gut talking here. I suppose you could use some sort of ca
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
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