Electronics Forum: high temp solder (Page 255 of 323)

HIP defect in BGA

Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan

Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ

Grey Solder After Cleaning

Electronics Forum | Tue Oct 20 05:47:42 EDT 2020 | Mike Konrad

Most often, dull solder joints (post cleaning) is a result of the cleaning chemical. Most (not all) modern cleaning chemicals are equipped with corrosion inhibition agents which prevent dulling. Check with your chemical supplier to see if your specif

Re: When using noclean flux or clean flux process?

Electronics Forum | Tue Sep 21 13:10:10 EDT 1999 | Dave F

| Dear All, | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | I mean that I wonder why we use

Voiding in board to BGA joints

Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan

Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern

Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti

High tin content @ Wavesolder

Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef

I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul

Re: Cleaning of 'No-Clean' paste

Electronics Forum | Mon Sep 13 11:02:08 EDT 1999 | Bill Schreiber

Mike failed to list the company that introduced the first ultrasonic stencil cleaner in 1990. The company remains the leader in stencil cleaning worldwide: Smart Sonic Corporation Tel: 1(800)906-4407 Fax: 1(818) 909-6409 e-mail: smt@smatrsonic.com w

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony

| | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,

Re: Hot air knif in wave soldering

Electronics Forum | Mon Sep 28 10:12:53 EDT 1998 | Chrys

| Hello, | I need some users information about "Air knif" in wave soldering: | 1. Does it decreases bridging ? | 2. Is it self installed of a purchesed kit (if purchesed, who are the recomended vendors) ? | 3. Any other information about the issue. |

Standoff heights for glue syringes

Electronics Forum | Tue Aug 04 11:10:22 EDT 1998 | Chrys

| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has


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