Electronics Forum | Tue Feb 24 13:22:10 EST 2009 | pcbrookie
Hi All, Pretty new here, and to the industry and doing my best to learn what I can. Sorry if this topic has been discussed extensively, but I couldn't seem to find it via a forum search. Our company recently purchased a 7-zone reflow oven to repla
Electronics Forum | Fri Jan 05 12:01:26 EST 2001 | Jim M
I've been involved with no-clean flux and conformal coat in the past.It has been my experience that the amount of no-clean flux used is proportionate to how well the conformal coat adheres to the boards.No clean paste did not affect adhesion. The co
Electronics Forum | Tue Oct 05 12:42:43 EDT 1999 | Chris May
| I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's
Electronics Forum | Fri Apr 26 10:42:28 EDT 2002 | Jim M.
I worked for a telecom company that had sites in the deserts, jungles, mountains and regular built up area's. All boards were built using Aim 291/293 No clean solder paste. (all boards built to Bellcore standard) The boards were coated with Dymax ur
Electronics Forum | Mon Apr 29 22:32:59 EDT 2002 | davef
See, I didn�t bite on you zinc diffusion trick that you tried to pull last week. Understand, in this response, I am NOT trying to bust you. I�m trying to determine what you are looking to understand. [Some times I get so locked into talking a cert
Electronics Forum | Thu Jan 23 14:19:56 EST 2003 | Mike Konrad
Hi Randy, No-clean flux needs to be activated in order to burn off the volatiles in the flux. This normally occurs partly during preheat and certainly during the reflow or soldering process. In most hand soldering applications, an operator applies
Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Wed Jan 18 17:07:32 EST 2006 | gregoryyork
Sorry Bob Could not respond been away busy. Just to correct you, we did not copy the SACX as we brought ours to market at least six months before so how could we copy, it is also a little different, but nicely reassuring when the 'big boys' do some
Electronics Forum | Mon May 14 14:34:05 EDT 2007 | rgduval
I have to agree with Jax. We've had some successes, and some horrible failures using white-tin. Generally in solderability, and apparently related to the somewhat more rapid deterioration of white-tin finishes. We've run white-tin as an SMT only
