Electronics Forum | Tue Jan 27 10:52:22 EST 2015 | dyoungquist
Taking a shot in the dark...... Are you using the correct oven profile for the connector? Solder tends to flow (wick) towards the hottest part of the connection/pin/pad it is on. It may be that the hottest part is the connector itself where the pi
Electronics Forum | Wed Mar 11 17:32:46 EDT 2015 | jlawson
Small paste deposits have less flux thus less flux activity to enhance the wetting. So preheat needs to be as short as possible, ramp to spike if possible. Try not to ramp hold and spike - pending thermal delta on product can be made to ramp to spike
Electronics Forum | Sat Mar 28 06:59:03 EDT 2015 | robertwillis
I would agree with the comments so far its much better to have some pre heat. You have not explained why bottom side preheat is a problem. Even having some input will help balance the process. Assume there is some thing on the back side that is a pro
Electronics Forum | Fri Sep 01 05:29:01 EDT 2017 | mona0312
Hi, Recently, i found a company called "jlcpcb". It’s very cheap 10pcs boards. 1.2mm thick, 1-OZ copper, 6/6-mil outer (0.1525mm) just cost $2 Cheap price and lots of options regarding board thickness, colour, etc. None of my boards have ever had a
Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk
In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t
Electronics Forum | Wed Mar 30 14:02:25 EDT 2016 | blnorman
The program I'm working on is having endcap metallization/resistive element failures. These are on MELFs manufactured by IRC/TTE (MCHP). A sister program is having the same issues. They pulled a couple of date codes and did visual examination and
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Tue Oct 25 11:48:03 EDT 2016 | dontfeedphils
Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, with a known good thermal profile. I'm guessing it
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Mon Feb 06 17:24:26 EST 2017 | westshoredesign
So I had the same question too when I was setting ours up. My lazy (and cheap) solution was: for each program I have a universal path that is used up to the first dispense instruction and after the last one then I covered the surfaces underneath tha
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