Electronics Forum | Wed Mar 30 14:02:25 EDT 2016 | blnorman
The program I'm working on is having endcap metallization/resistive element failures. These are on MELFs manufactured by IRC/TTE (MCHP). A sister program is having the same issues. They pulled a couple of date codes and did visual examination and
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Tue Oct 25 11:48:03 EDT 2016 | dontfeedphils
Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, with a known good thermal profile. I'm guessing it
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Mon Feb 06 17:24:26 EST 2017 | westshoredesign
So I had the same question too when I was setting ours up. My lazy (and cheap) solution was: for each program I have a universal path that is used up to the first dispense instruction and after the last one then I covered the surfaces underneath tha
Electronics Forum | Tue Feb 21 01:32:49 EST 2017 | soldertraining
Looking for advice on soldering lead free paste to a board with very heavy gold plating, In my opinion, Gold contact surfaces are often used on circuit boards with membrane switches which is a choice of technology for industrial, commercial and consu
Electronics Forum | Thu Jun 08 16:12:19 EDT 2017 | davef
Your plater's recommendation should work fine. Your simple copper plate will work, but you'll be stepping into fighting a copper tarnish battle. Silver over the copper is a better choice. I was thinking a silver thickness of a minimum of 3 microns
Electronics Forum | Thu Jun 15 06:58:54 EDT 2017 | cyber_wolf
Hmmm.... When I clean my stencils after I run a job, it is to clean the paste off the stencil so it doesn't dry out in the apertures and on the stencil surface while it is being stored. Wiping the stencils during production is to clear the paste of
Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Tue Apr 24 09:19:51 EDT 2018 | vetteboy86
Is there a preferred method among printed circuit board assembly for accurately and quickly verifying the copper weight of a printed circuit board? I would like a tool and process that our quality inspector could quickly use to verify upon receipt of
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