Electronics Forum | Wed Feb 23 16:25:33 EST 2000 | John
We are using a glue and wave solder process for primarily chip components. Our products do not use any fine pitch components. What would an acceptable benchmark for the placement defect rate be? 50 DPMO? 100 DPMO? 200 DPMO? Thanks in advance,
Electronics Forum | Fri Feb 18 12:31:08 EST 2000 | Steve Thomas
I've got a process run amok, really thick skin, and a little bit of knowledge. Now you REALLY oughta be shakin' in your boots.
Electronics Forum | Thu Feb 10 18:53:04 EST 2000 | Russ
It is okay to use OA flux if you have a very robust cleaning process. lots of water and saponafier are good things. No-Clean is much safer when it comes to reliability. I personally like the Indium no-clean products. Russ
Electronics Forum | Thu Feb 10 13:54:22 EST 2000 | Kris W
Hi All, We are in the process of converting from RMA solder paste to no-clean process across the shop. This will allow me to carry my semi-aqueous cleaner out of the building and set it ablaze using the terpenes as the fire water. Then I can go ab
Electronics Forum | Mon Feb 14 20:29:20 EST 2000 | Russ
It was the wave process, Just thought I'd let everyone know for future reference. Partial reflow at selected leads I am now aware that 63/37 does indeed have "a slushy zone" that I thought was not possible. Russ
Electronics Forum | Mon Jan 15 08:24:32 EST 2001 | adrian
I thought the stencil was flush to the top of the board when Screen printing. When does this snap off occur in the screen printing process?
Electronics Forum | Fri Jan 05 19:47:08 EST 2001 | slowe
Hey everyone, Does anyone out there use a solder paste height measuring system ? I would like to know what the standard is for paste height compared to stencil thickness and how you use it as a process tool. I appreciate any help. Thanks, Steve.
Electronics Forum | Thu Jan 04 20:16:02 EST 2001 | Mike Konrad
Hi Cory, As a manufacturer of aqueous cleaning systems, my advise is somewhat biased, however I believe it to be accurate. We have hundreds of customers who have implemented no-clean programs. The programs have been successful when measuring the r
Electronics Forum | Wed Jan 03 18:44:13 EST 2001 | Todd Koeppel
If we procure parts with a Sn/Ag termination, can we still use standard Sn/Pb solder pastes and the current reflow and wave processes?
Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F
Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an
