Electronics Forum | Thu Dec 12 12:54:25 EST 2013 | jaimebc
For selective soldered components, or even hand soldered, with vertical bend components, the body of the component, in this case a resistor, is making contact with the surface of the PCB, making it impossibe to visually see the solder fillet. Or to d
Electronics Forum | Mon Dec 23 13:18:04 EST 2013 | stustu
I'm fairly new to SMT, but highly experienced in other materials engineering areas. But have found the definitions/specifications for pastes to be both confusing and inadequate. I have often see graphical representations of the "desired" thermal pro
Electronics Forum | Tue Jan 14 13:26:28 EST 2014 | emeto
You can also see this: http://www.efd-inc.com/NR/rdonlyres/7C8592BD-70D0-4A0A-91C4-2A2743EB6710/0/EFDFrequentlyAskedQuestions.pdf
Electronics Forum | Wed Mar 12 09:14:09 EDT 2014 | neiderman
If you havent already resolved the issue. I would recommend running a wave profiler and see if you are actually getting the same thermal profile in each machine. Generally speaking you need to run different preheater settings for different brand wave
Electronics Forum | Tue Feb 11 12:02:52 EST 2014 | javierec
Process: Batch Cleaner, @16% concentration. Concentration is checked daily. Cleaning after Wave Process. See attached pictures and comment and what you think causes the solder joint to turn grey. i have read post that say the grey dull looking sol
Electronics Forum | Fri Feb 28 15:27:50 EST 2014 | tombstonesmt
Good afternoon! Looking to see what everyone else in the industry is running for print speeds regarding type 3 solder pastes. Our paste is a type 3 with 11.5% ROL0 flux content. The finest pitch component in our case is .5mm pitch. Our screen print
Electronics Forum | Fri Mar 07 15:57:32 EST 2014 | jdengler
We have used the Stencilquik™ BGA Stencils from the same supplier to attach some LGA's for a prototype run. We were able to get a few different thicknesses to see which worked best. They worked very well for that limited application. We did not tr
Electronics Forum | Fri Apr 11 12:42:29 EDT 2014 | emeto
Hello all, does any body place PoP parts? We are running them through a regular process(paste place reflow) and we don't have good rates on these. Mostly we observe opens at the sides of the part. We are thinking to purchase a flux feeder, but I wan
Electronics Forum | Tue May 06 21:24:28 EDT 2014 | davef
Most ceramic you'll see comes from Coors or Kyocera. Size of your substrate will vary according to the stencil / component that you're using. 3" by 3" should be sufficient for most applications. If you get them too small, you could have handling is
Electronics Forum | Fri May 23 15:33:39 EDT 2014 | hegemon
I don't see any visuals that make me think of black pad phenomena. I do note that it appears that pads on the BGA itself have detached and been left on top of some of the solder balls. To me it looks like the temperature profile is not correct, not
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