Electronics Forum | Wed Jan 27 20:18:42 EST 2016 | lordorica
Trying to find a laser marking machine. Thing is that most of my pcbs have white solder mask, so the when trying to read the 2D code is difficult due to the lack of contrast. Any idea? a different technology? regards
Electronics Forum | Thu Feb 04 20:15:57 EST 2016 | lordorica
I don't own a laser printer right now. I sent samples to some vendors and I couldn't read the codes. Have pictures of 2D codes on white solder mask? Thanks
Electronics Forum | Thu Feb 04 12:01:07 EST 2016 | g2garyg2
Hi Luis A white mask typically helps in the marking process since you are not reliant upon the PCB layers to create the contrast. Laser marking is really an etching process, so if your laser is set properly (power and focus) the goal with mask is to
Electronics Forum | Thu Aug 25 07:53:03 EDT 2016 | babe7362000
I was wondering how I would program the Mirtec MV-3L for through hole solder? Do I need to bring in the solder mask file? or can I do manually? Thanks
Electronics Forum | Fri Apr 06 04:10:25 EDT 2001 | kensmoke
We recently had a multi block panal change at the vendor Now the production lines are producing solderability defects in great number. The makeup of the pcb is a type of fiber glass mask green in color and pads with no tinning just copper lands.
Electronics Forum | Fri Aug 25 07:36:13 EDT 2006 | davef
We'd do it the same way that you did, except apply no solder mask over the heat slug.
Electronics Forum | Mon Feb 08 15:46:15 EST 2016 | g2garyg2
I would be happy to accept some samples and mark them for you. PROMATION USA, 9522 58th Place, Suite 100, Kenosha, WI 53144 - Let us know
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Fri Aug 25 09:15:43 EDT 2006 | russ
We use a single large pad on board and reduce stencil aperture 50%. If you mask/reduce the thermal pad the solder will not wet out to edges and you will still see the part standoff with the open joints. the purpose of reduction is to wet the paste
Electronics Forum | Sat Sep 18 12:10:19 EDT 2004 | Steve Gregory
I have a question about solder masking via's in a BGA pattern, and want to see if I'm thinking correctly about this. This problem is kind of along the same line as Carol's problem earlier. I think it's a bad idea to leave the via's free from solder
