Electronics Forum | Thu Oct 12 22:36:40 EDT 2017 | stefan110882
Please ost some pictures so we can see what > you're talking about. OK here an example. I'm sorry for the bad quality - The picture is cropped and only one of two pictures that I had on the phone that I could use. According to my supervisor, th
Electronics Forum | Fri Oct 12 16:01:23 EDT 2018 | davef
Feature||Class 1||Class 2||Class 3 Circular wetting of solder of the lead and plated hole barrel on the component side.||Not Specified||180 deg||270 deg Plated hole fill.||Not Specified||75%||75% Circular fillet and wetting of solder of the lead a
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Mon Nov 13 11:31:10 EST 2000 | John Rep
I am having a problem with wetting on some feedthru wires. The problem seems to be contamination on the wires, due to the fact that the problem seems to be wire lot dependent. I have analysed it using SEM and come up with very little. Is there ano
Electronics Forum | Thu May 04 17:14:11 EDT 2000 | Boca
Solder 'follows' heat, sounds like the fab is heating up faster than the component. Or the components are solderability 'chanllenged' and the paste turns liquid, and would rather spead out on the land than wet to the component termination. Are thes
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Fri Mar 16 13:33:21 EST 2001 | gdstanton
Anyone out there have a real good stencil printing process control document for an MPM Corporation stencil printer model # SPM? We are seeing lots of bridging, wetting, and filling problems. Thanks in advance for your help.
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Mon Apr 23 20:33:37 EDT 2001 | davef
I agree that solderability is THE issue, but we choose not to get into that pissin' contest. [We don't like the selected test method, either.] We believe that our coating thickness spec provides: * Solderability level that we seek. * Repeatable tes
