Electronics Forum: yield (Page 27 of 55)

Process Costing

Electronics Forum | Thu Feb 05 23:55:52 EST 2009 | sachu_70

Considering a lean management on your shopfloor, any amount of inspection being done to a board, either by QA or Production personnel, does not add value to your product but instead, adds to your operational cost. You can explore to possibility of ca

IP3 placement for BGA / MicroBGA

Electronics Forum | Tue Mar 17 07:35:37 EDT 2009 | nagesh

We have the IC placer Fuji-IP3 machine.Can this machine be able to place MicroBGA / BGA with good vision system.My card has almost 8 BGA with 4 MicroBGA?Still now i had placed 1 or 2 BGA(Placement by body centering).In this machine the Y- table keeps

BGA re-balling yields

Electronics Forum | Mon Apr 20 14:59:14 EDT 2009 | c111

We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource. 1) What percent fallout should I expcet from the re-balling process. 2) After

BGA re-balling yields

Electronics Forum | Wed Apr 22 07:54:18 EDT 2009 | clampron

Cood Morning, We have a similar situation. We have had a large volume (5K) of RoHS BGA's reballed with 63/37. We have had only a few failures most of which do not appear to be related to that particular BGA. Potential BGA failures are running under

DPMO & OMI CLARIFICATION - MR.MICHAEL PARKER & DAVEF

Electronics Forum | Thu Jun 18 07:34:46 EDT 2009 | rameshr

Dear Mr. Davef & MR. Michael Parker, We have deveoped a Base document for calculating DPMO & OMI to convert our product yield to PPM Monitoring level , Kindly provid eme your email id, so that i will post the message to you & if need any modificatio

AOI for solder inspection

Electronics Forum | Sat Nov 07 10:09:52 EST 2009 | ramses2001

Hi Nemo, In my factory we have an offline AOI from VISCOM for two SMT lines. It's not so easy to program, but the results are very good. Anyway you should have to think that an AOI system needs a human inspector and a technician to debug the program

BGA Thermal Profiling

Electronics Forum | Fri Aug 19 02:05:32 EDT 2011 | ppcbs

We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assem

ICT testing to improve yields

Electronics Forum | Thu Aug 23 21:36:21 EDT 2012 | padawanlinuxero

Hello I would go for a Teradyne Z18xx those are kinda low budget, there are some companies that sell them refurbish right off my head I can think of Rocky Mountain Test Equipment talk to John Cowling (303 693 3322) and for the ICT fixtures so that

No-Clean flux residue from Secondary Ops

Electronics Forum | Mon Sep 23 12:59:12 EDT 2013 | pauldavis4

New pcba supplier sent us first article pcbas (SMT, Wave & hand solder operations) that failed our testing due to no-clean flux residues found under ICs and around passive capacitors. Second lot came in and had 100% pass yield, but we still see a cl

What is a typical SMT placement defect rate?

Electronics Forum | Wed Jul 16 11:57:11 EDT 2014 | markhoch

We're a Tier 1 Automotive Supplier building, what I like to call, Peanut Butter and Jelly Boards. (High Volume, Low Complexity) Our first pass yield, using standard 1st Article Inspection and AOI is about 98-99% on any given day. Last night, for ex


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