Electronics Forum: pads (Page 262 of 555)

Fillet height of SMT chip capacitor

Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas

In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part

Aluminum Capacitor disassociated from sodler joint

Electronics Forum | Tue Feb 19 11:27:25 EST 2019 | emeto

Thanks Rob, actually the thermal relieve is very poor. We did attach the thermo couples on the pad so that is checked. I will now check solderability.

drill hole overlapped? is it acceptable ?

Electronics Forum | Tue Mar 19 17:08:12 EDT 2019 | asksmt

Hello Experts, is it acceptable in IPC standard to have two drill hole on a single pad overlapped? soldering and reliability wise ? intent is to solder two parts in parallel together. Thanks for your comments.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef

Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?

QFN/BTC Pad Configuration Commonality for Solder Stencils

Electronics Forum | Tue Apr 30 12:11:05 EDT 2019 | slthomas

That's a good summary and the only thing I would add to that is maybe to include an image of the land pattern in your collection. Some of these asymmetrical parts are just about impossible to provide all of the dimensions for. For instance, who want

QFN/BTC Pad Configuration Commonality for Solder Stencils

Electronics Forum | Tue Apr 30 14:56:43 EDT 2019 | SMTA-Joe

Thanks for the suggestions. This seems like the way I'll have to go; create my own database and hope something--one day--comes up the same specs!

Component drop after reflow

Electronics Forum | Thu Jun 27 08:12:17 EDT 2019 | SMTA-John

If the case shield is solderable, add pads to the edge of the two through holes and paste . This wetting should hold it in place.

Component Skew during Reflow Process

Electronics Forum | Thu Aug 01 14:18:35 EDT 2019 | huske

Looks like you have too much solder, looks like is balling out of the side of your pads.

Component Skew during Reflow Process

Electronics Forum | Fri Aug 02 09:55:41 EDT 2019 | davef

While I agree there is "too much solder" on this board, I don't think that is the sole explanation of what's going on here. I don't think the pads on the board match up well with the terminations on the components.

Component Skew during Reflow Process

Electronics Forum | Fri Aug 23 12:51:03 EDT 2019 | ameenullakhan

Hi , We are using 5 mil thickness. Sure will very the PAD with component data sheet recommendation. Regards, Ameen


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