Electronics Forum | Wed Mar 03 11:51:08 EST 1999 | Richard
Would there be any process issues with having SM components placed on the solder side of a PCB which are below a BGA on the component side. It is a double sided wave soldered PCB.
Electronics Forum | Wed Feb 09 10:34:19 EST 2005 | Ron
Is anyone currently reflowing a board with SC44 devices on it. This is a 6pin SAW filter with castellated terminations. I'm looking for a solder paste design for this part. I currently use a laser cut 6mil thick stencil.
Electronics Forum | Fri May 30 07:00:41 EDT 2008 | radizouani
What is the distance between smd components that should be held in consideration due to selective soldering ( size soldering nozzle) ? What is your advise due to the purshase a selective soldering machine.
Electronics Forum | Wed Aug 30 21:44:56 EDT 2006 | IRAS
HI, I am looking for the smallest wave soldering machine available. So far I have found some that have a total of 8 feet in length, and a foot print of 5.5 feet wide. Is there a wave solder smaller than this?
Electronics Forum | Thu Mar 19 16:13:28 EDT 2020 | stephendo
I tend to go by extending it by a distance rather than a per centage. For example 10 thou over. Does anyone else give a distance rather than a per centage? For long pads on connectors where I need more solder, a per cent doesn't make sense to me.
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Tue Sep 01 20:43:06 EDT 2009 | davef
Please explain "adhesion of soldering is not uniform at the tips (soldering ends)." For example: * Is the "tips (soldering ends)" the component leads? * What is the component? * What is the finish on the component? * What process is causing this issu
Electronics Forum | Tue Dec 13 12:47:53 EST 2005 | grantp
Hi, No because we don't have the ability to do that, and what is the problem with it? Can you describe what happens and how it's different to soldering a high temp BGA solder ball. My guess is if the solder ball does not melt, then there should be n
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy
Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o
