Electronics Forum | Fri Nov 01 11:27:34 EST 2002 | kenBliss
Gimme a break I am rather disappointed with many of the comments here. Most appear to think that the OEM should supply what ever is needed and when ever it is needed and not charge for it or just do it cheap. Or you think they overcharge for it.
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika
conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe
Electronics Forum | Sat Mar 31 11:03:21 EDT 2007 | jmelson
I have a left to right conveyor, so the X offset is larger, but that is not major. You say "Make sure you are teaching with the unit that the machine defaults to or asks for." This is the beam sensor, and I have found no way to change this, either
Electronics Forum | Wed Sep 17 13:00:25 EDT 2008 | mw_fl
For the most part there would not be a lot of change over. There are two primary boards at this time that would be run on the line that also use common components. At this point all but a couple of the pick and place machines we have looked at have t
Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
Electronics Forum | Thu Nov 04 19:42:21 EDT 2010 | eadthem
We do almost exclusively SMT parts but for solder with a 45 degree fillet angle use vertical light type and a binarise threshold of 128(1/2 dark 1/2 light) and use the 2nd option or dark=dark light=light _|" in vertical light solder fillet is dar
Electronics Forum | Mon Apr 21 13:48:32 EDT 2003 | davef
ISO 9001-1994 and ISO 9001-2000 are significantly different regarding 'process'. In the 1994 version, processes were considered to be routine manufacturing processes [eg, drill a hole]. In the new ISO, a 'process' is more global and covers anything
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
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